{
    "id": "ted:670077-2026",
    "url": "https://outfortender.com/tender/ted-670077-2026",
    "official_notice": "https://ted.europa.eu/en/notice/670077-2026/html",
    "title": "Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers",
    "titles": {
        "de": "Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers"
    },
    "description": "The subject of the procurement is the supply, installation and commissioning of a semi-automatic wafer prober system for the electrical and high-frequency characterization of 200-mm wafers for research and laboratory use at IHP. The system shall include, among other components, a 200-mm wafer prober with vacuum chuck and precision positioning, individual probes, multi-contact probes for RF measurements up to at least 6 GHz, a probe card system, automated microscopy and camera equipment, as well as control and software components. The scope of supply also includes transport, installation, commissioning, training, documentation, warranty and spare-parts supply.",
    "description_language": "de",
    "buyer": "IHP GmbH - Lebniz-Institut für innovative Mikroelektronik",
    "country": "DE",
    "country_name": "Germany",
    "category": "Laboratory, optical and precision equipment",
    "cpv": "38540000",
    "procedure": "open",
    "published": "2026-09-29",
    "deadline": "2026-10-29T12:00:00+01:00",
    "status": "open",
    "source": "ted"
}