Deep Reaction Ion Etcher (DRIE)

Was der Auftraggeber sucht

Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.

Sprache dieser Bekanntmachung: English. Titel und Beschreibung erscheinen genau so, wie der Auftraggeber sie veröffentlicht hat.

How this compares

• This is one of 23 open tenders in Schweden for Industrielle Maschinen.
• Its stated value is higher than 0% of the 23 open tenders in this category that state a value in SEK.
• Bidders were given 32 days from publication to the deadline; the median for open tenders in Schweden is 30 days.

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