Deep Reaction Ion Etcher (DRIE)

Qué solicita el órgano de contratación

Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.

Idioma de este anuncio: English. El título y la descripción se muestran tal como los publicó el órgano de contratación.

How this compares

• This is one of 23 open tenders in Suecia for Maquinaria industrial.
• Its stated value is higher than 0% of the 23 open tenders in this category that state a value in SEK.
• Bidders were given 28 days from publication to the deadline; the median for open tenders in Suecia is 30 days.

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